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As smartphone designs continue to evolve toward "ultimate screen-to-body ratio" and "thin and light aesthetics," ultrasonic fingerprint recognition technology has become a standard feature of high-end flagship mobile phones due to its advantages of strong penetration, unlockability with wet hands, and high security. However, in the context of the continuous compression of the internal space of OLED displays, how to achieve reliable fixation and precise signal transmission of fingerprint modules within a small area has become a new challenge facing the display industry chain.

Recently, tesa, the world's leading tape solution provider, has launched a series of conductive tapes specially designed for ultrasonic fingerprint module bonding applications - tesa®6070x to address this industry pain point.

According to reports, this innovative solution aims to solve the core problems of fingerprint module fixed area reduction, signal transmission stability, environmental tolerance and flatness control in highly integrated OLED displays.

▋ Technical challenges: New pain points in bonding under high integration

As mobile terminal design develops in the direction of thinner, lighter and more integrated devices, the structure of fingerprint film locks becomes increasingly compact. In practical applications, engineers often face the following difficult problems:

Reduced fixing area: The area and space left for the fingerprint film lock to be fixed is getting smaller and smaller. How to maintain high-strength and reliable fixation in a small size to cope with long-term and high-frequency use pressure?

Anxiety about signal loss: Ultrasonic fingerprint recognition is extremely sensitive to signal transmission. If the impedance of ordinary bonding materials is unstable, it can easily lead to a decrease in sensitivity.

Harsh environmental tests: Accidental collisions, UV aging and daily waterproofing requirements require fixing solutions to have excellent impact resistance, weather resistance and waterproofing.

Flatness challenge: In OLED and other module integration, tiny thickness unevenness or surface bubbles will affect the final display effect and recognition accuracy.

▋ tesa releases tesa® 6070x series solutions

In response to the above pain points, tesa has launched a targeted conductive bonding solution for ultrasonic fingerprint film lock bonding applications - tesa® 6070x tape series.

Scan the QR code to download "Introduction to tesa Ultrasonic Fingerprint Film Lock Solution"

This series adopts a unique product design, using copper foil as the base material, and cleverly applying two different acrylic adhesives, black and transparent, on both sides of the base material. The black side ensures a consistent appearance and prevents light leakage or visual interference. The transparent surface provides excellent bonding performance to ensure that components are firmly fixed. This double-sided differentiated design takes into account aesthetic needs while ensuring functionality.

From a performance perspective, this series of products is specially designed for FPC and display modules. It performs excellently in signal transmission and can ensure stable ultrasonic fingerprint sensing performance. Even in a small space, it still has high stability, providing reliable fixation for the module without fear of daily impact and high-frequency use. At the same time, it has good flatness, and the thickness can be precisely controlled and customized according to the different design requirements of the terminal OLED display.

From the perspective of industrial development, conductive tape, as a key material in electronic manufacturing, is continuing to grow along with the trend of miniaturization and high performance of electronic products. As 5G technology becomes more popular, the electric vehicle market expands, and IoT devices grow, the need for EMI shielding and conductive connections will continue to rise. Especially in the field of ultrasonic fingerprint recognition modules, the demand for high-performance conductive tapes is expected to grow simultaneously with the increase in market penetration.

The tesa®6070x series launched by tesa this time is not only a single product innovation, but also a reflection of collaborative innovation in the display industry chain. From upstream OLED panel manufacturing, to midstream fingerprint recognition module integration, to downstream terminal equipment assembly, technological progress in every step relies on the support of material science.

With the continuous improvement of the domestic OLED industry chain, China's display industry is transforming from "scale leadership" to "technology leadership". In this process, the professional solutions provided by material suppliers like tesa will become an important support for the upgrading of the industrial chain.

▋ Join hands with tesa to accelerate display innovation

Looking to the future, with the rise of flexible displays and wearable devices, conductive tapes need to have better bending and stretchability to adapt to complex deformation requirements. At the same time, with the penetration of ultrasonic fingerprint recognition technology into mid-to-low-end models and the expansion of OLED displays into more application scenarios, the market demand for such specialized material solutions is expected to further expand.

Desa said that the company will continue to pay attention to the technological evolution of the display industry, and provide a full range of technical support and services to industry chain partners, from early technical consultation to later implementation of customized solutions. If you are facing the problem of bonding ultrasonic fingerprint modules, or want to know more about tape matching suggestions for OLED and other display screen designs, please contact tesa for one-to-one solution advice.

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