Shijia Photonics adds coding optical chips, etc., and plans to raise no more than 2.8 billion yuan to expand production.

On July 16, Henan Shijia Photonics Technology Co., Ltd. disclosed its plan to issue A shares to specific investors in 2026. The company plans to issue shares to no more than 35 specific investors, and the total amount of funds raised will not exceed 2.8 billion yuan.

After deducting issuance costs, the raised funds will be invested in four directions: high-speed AWG chip and optical interconnection component production capacity construction, continuous wave laser chip and COC industrialization, high-density optical interconnection device production capacity expansion and supplementary working capital.

The number of shares issued this time will not exceed 30% of the company's total share capital before the issuance, that is, it will not exceed approximately 136 million shares. The relevant proposal has been reviewed and approved at the 16th meeting of the company's fourth board of directors on July 15, 2026, and still needs to be submitted to the shareholders' meeting for review and regulatory agency review and registration.

According to the plan, this fundraising project closely focuses on the company's main business and core technology. Among them, the total investment in the high-speed AWG chip and optical interconnection component production capacity construction project is approximately 769 million yuan, and it is planned to use 750 million yuan of raised funds. The construction period is 3 years. It will mainly be used to improve the manufacturing and batch delivery capabilities of passive optical components such as AWG chips, FAU, and MT-FA.

The total investment in the continuous wave laser chip and COC industrialization project is approximately 1.456 billion yuan, and it is planned to use 1.4 billion yuan of raised funds to focus on high-power active optical chips and packaging products such as 100mW CW DFB laser chips and 400mW CW DFB COC, targeting application scenarios such as high-speed optical modules, silicon light and CPO external light sources.

The total investment in the high-density optical interconnect device production capacity expansion project is approximately 172 million yuan, and it is planned to use 170 million yuan of raised funds to expand the production capacity of MPO and MMC series optical fiber connectors. In addition, 480 million yuan will be used to supplement working capital and optimize capital structure.

Shijia Photonics is one of the core companies in the field of domestic optical communication chips. The company's main business covers three major sectors: optical chips and devices, indoor optical cables, and cable polymer materials. It has long adhered to the layout of passive and active dual platforms. Its products include PLC splitter chips, AWG chips, DFB laser chips, optical fiber connectors and optical components, etc., which are widely used in backbone networks, metropolitan area networks, data centers and AI computing infrastructure.

At the technical level, Shijia Photonics' AWG chips used in 1.6T optical modules have entered the customer verification stage for many head optical module manufacturers. Silicon optical modules use CW DFB lasers to achieve small batch shipments, and 100G EML laser chips are also undergoing customer verification.

In addition, the company’s 1550nm DFB laser for lidar has passed automotive certification and been introduced into the automotive supply chain. In terms of customer cooperation, the company's AWG components have been supplied in batches to leading manufacturers such as Zhongji InnoLight and Xinyi Sheng. Its overseas business covers European, American and Southeast Asian markets, and it has built a global operation platform through subsidiaries in the United States, Singapore, and Thailand.

Shijia Photonics stated that with the rapid development of AI computing infrastructure, the demand for high-speed, large-capacity, and low-power optical interconnect products continues to grow within and between global data centers. Optical modules are iterating towards 800G, 1.6T and even higher rates, and new technology routes such as silicon photonics, CPO, and NPO are evolving in parallel.

Some of the company's existing product production capacity and packaging and testing capabilities are facing further improvement needs. After the implementation of this fundraising project, the company's large-scale manufacturing capabilities in the field of high-speed optical communication core chips and devices will be significantly enhanced, the product system from passive chips, optical components to optical interconnect devices will be improved, and the comprehensive supporting service capabilities for downstream customers will be improved.