Huayinxin received another round of financing

According to Qichacha, on January 6, Huayinxin completed the C+ round of financing, and the new investors were Ruijiang Investment, Optics Valley Venture Capital and Kehua Fund.

Source: Qichacha

Huayinxin Technology Co., Ltd. was established in Wuhan Optics Valley. It focuses on the research and development, packaging and testing of high-end light source chips and optical devices, and has independent intellectual property rights. The company's products include automotive specifications, Mini/Micro LED display light sources and packaging devices, which are used in the display, vehicle, ultraviolet and infrared light source markets, and have entered the supply chain of some domestic panel manufacturers and OEM OEMs.

According to experts, Display understands that in 2025, Huayinxin will create a CSP-Mini LED backlight solution with excellent performance and cost through full-link innovation and optimization of light source chips, packaging structures, optical designs and full-color processes.

At present, this solution has been introduced into many OEMs on a large scale, helping end products achieve a perfect balance between image quality and cost. During the 2025 618 promotion, sales of display products surged. Huayinxin Technology relies on CSP chip-scale packaging technology to achieve a 10-fold year-on-year increase in Mini-LED backlight shipments.

At the same time, this self-developed light source has passed AEC-Q102 automotive grade certification, becoming the first CSP Mini-LED product in China to receive this certification, promoting the large-scale application of Mini-LED backlights in MNT, TV, automotive, VR and other scenarios.

Huayinxin Mini-LED backlight application scenarios

In early 2025, Huayinxin also launched a heterogeneous integrated product with an optical drive, which has been applied to Titan Legion's new e-sports display. This solution integrates the light source chip and the driver IC into a single package, achieving one-time placement, simplifying the process, and the mass production yield reaches 99.5%. The core of the technology is the combination of C2OX architecture and CSP miniaturization packaging, which can maintain stable performance under high-density integration conditions.