High innovation VS short cycle: tesa’s “collaborative engineering” accelerates the development of next-generation displays!

As display technology evolves toward higher integration and more complex forms, basic material processes such as bonding, thermal conductivity, sealing, and light blocking have been upgraded from "auxiliary" roles to core elements that determine product reliability, performance, and innovation cycles.

Recently, tesa launched an in-depth solution for its "joint engineer" positioning. The system demonstrated its mature solutions in the fields of ultrasonic fingerprint module bonding, camera module structural bonding, optical transparent bonding, etc., and further extended its capabilities to segmented scenarios such as metal backplane bonding, FPC bonding, display thermal management, and large-size frame fixing.

Display technology is changing rapidly. As a display engineer, are you also facing severe challenges:

How to achieve accurate balance between the ever-increasing demand for innovation and the ever-compressed development cycle?

Relying on forward-looking solutions, profound technology accumulation in the electronics industry, and a highly collaborative cooperation model, tesa has already surpassed the role of a traditional supplier. tesa is your "co-engineer"! We are committed to helping you realize your innovative vision and jointly create a new generation of future-oriented display devices.

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An easier and more efficient innovation experience

tesa's tape bonding solutions have been fully proven in today's many display applications and are continuously optimized for the future, helping engineers turn innovative ideas into reality in the following three key areas:

Ultrasonic fingerprint film lock bonding: tesa's conductive tapes excel in performance, flatness, appearance consistency and signal transmission. It is suitable for various terminal OLED display design matching needs and can be fully customized according to needs. Camera module bonding: Structural adhesive tape can provide glue-level superior bonding strength and high reliability in small areas. It helps the camera bonding process to be precise and without displacement, without spillage of bonding material, and to maintain high stability after bonding. Optically transparent lamination: tesa optically transparent tape has excellent bending resistance and curved surface bonding properties. It is suitable for laminating folding devices and AR/VR displays, providing them with excellent optical performance and high reliability.

In addition, tesa also provides you with a full range of adaptation solutions for more niche applications:

Metal backplate lamination: tesa's base-free tape provides excellent appearance and gap filling capabilities, effectively reducing bubbles generated during and after lamination, improving the overall assembly quality. Light blocking: tesa single-sided masking tape and double-sided tape have excellent anti-rebound properties. Suitable for light blocking applications in LCD backlight modules to ensure high bonding performance. FPC bonding: tesa's iconic PET tape and conductive tape can ensure reliable bonding between FPC and backplane, and are widely used in LCD and OLED display applications. Thermal management: tesa's ultra-thin thermal tape is suitable for thermal interface management of OLED displays. It can improve heat dissipation efficiency while ensuring good flatness and appearance. Frame fixation: Relying on tesa's cross-industry application experience, tesa's thick foam tape can achieve reliable fixation between the glass cover and the frame, and is suitable for display applications such as car screens and large-size smartphones.

Scan the QR code to download "Introduction to tesa Display Application Solutions"

Let’s move forward together to promote display innovation

As a global innovator in the field of industrial tapes, tesa provides electronics manufacturers in Asia Pacific and Greater China with the solutions, services and support they need to help you develop steadily in today's highly competitive market environment.

Regional Customer Solution Center: There are 4 exclusive customer solution centers to support true collaborative R&D and joint engineering. Localized support is closer to the market and response is more efficient. Stable and reliable supply chain system: 2 production bases and 15 logistics centers are deployed in the region to ensure safe and stable delivery capabilities even in uncertain environments. Excellent product innovation capabilities: Through close cooperation with customers, we continue to develop a series of forward-looking innovative solutions. Global manufacturing network: supports more flexible localized production and offshore layout. Full life cycle support: Actively respond to market demand for more sustainable solutions by supporting product repair and recycling.

Scan the QR code to submit your requirements and accelerate display innovation!