Exhibition Review | SEMICON CHINA 2026 comes to a successful conclusion

The three-day SEMICON CHINA 2026 Shanghai International Semiconductor Exhibition came to a successful conclusion. Intelligent Cube brought its core semiconductor equipment to the 2014 booth in Hall N2, focusing on presenting full-chain solutions for semiconductor mid- and back-end processes as well as high-precision placement for advanced packaging and special testing and sorting core equipment for the RF front-end industry. It discussed technological innovation and industrial cooperation with industry partners at home and abroad.

01

Exhibition and booth site

At this SEMICON CHINA 2026 Shanghai International Semiconductor Exhibition, the N2 Hall-2014 double-layer theme booth built by Smart Cube has become a popular focus at the exhibition site with its highly recognizable design and immersive display space, perfectly carrying the dual display of the brand's technical strength and industry influence.

02

On-site demonstration of three prototypes attracted fans

During the exhibition, three star prototypes of fully automatic IC detection and sorting taping equipment, high-precision multi-chip flip-chip placement machines, and multi-chip mounting and die-bonding machines were demonstrated on-site. With their micron-level placement accuracy and high-speed and stable detection and sorting performance, they attracted a large number of professional visitors to stop and communicate. The products cover core processes such as wafer inspection and sorting, chip bonding, appearance inspection, board-level packaging, and optical chip routing. They are widely adapted to diverse scenarios such as optical communications, storage, computing power, 5G&RF, automotive electronics, and advanced packaging. With the technical advantages of high precision, high efficiency, and high compatibility, they have been highly recognized by on-site customers.

Fully Automatic WTR IC Sorting Machine

Product introduction: WTR IC detection and sorting taping equipment is a high-speed sorting machine specially used for six-sided appearance inspection of IC chips. Pick up the unplasticized bare die from the blue film, pass it through six-sided appearance inspection and near-infrared inspection, and finally put it into the braid.

High accuracy Multi-die Flip-Chip Die bonder

Application scenarios: Mainly used in consumer electronics, high-performance computing, AI, wireless networks, 5G & RF, etc.

Product introduction: MDB-FC300 is an advanced flip-chip placement system, specially designed to meet the high-precision requirements of advanced semiconductor packaging. The system's exceptional accuracy, speed and flexibility make it ideal for mass production of flip-chip devices. In order to achieve excellent performance, MDB-FC300 integrates cutting-edge visual alignment, force control and high dynamic performance technology to ensure that chip placement reaches micron-level precision and is stable and reliable.

Multi-chip bonding machine

Multi DIe Bonder

Application scenarios: Suitable for CIS, MEMS, memory chips, power devices and optical devices/optical modules, etc.

Product introduction: Specially developed and designed for high-precision, multi-chip, and complex process die bonding. It has a high-precision mechanical operation control platform, machine vision and algorithms. The highly modular design supports flexible configuration, optimized algorithms and precise force control to ensure placement quality. Supports glue painting, glue dipping, flux dipping, die bonding, eutectic, flip chip and other processes, and is widely used in memory, industrial lasers, optical communications, laser radar, CIS, MEMS, IGBT and other industries.

03

Negotiate and communicate with customers to explore new opportunities for cooperation

During the three-day exhibition, the popularity of the Smart Cube booth continued to rise. The team held in-depth discussions with industry experts and customers around issues such as sorting, die bonding, packaging and testing efficiency improvement, yield optimization, and advanced packaging implementation, docked cooperation needs, and shared technical solutions, further solidifying the foundation for market cooperation and conveying the innovative strength of domestic semiconductor equipment.

Pictures of exchanges at the exhibition

04

Innovation never stops, and we jointly start a new process of industrial upgrading

Innovation never stops, and the three-day event concluded successfully, which is not only the end but also a new starting point.

As a high-tech enterprise specializing in semiconductor automation equipment, Intelligent Cube will continue to focus on technological innovation and continuously iteratively upgrade products and solutions to help the semiconductor industry improve quality and efficiency and accelerate domestic substitution.

Next year, at SEMICON CHINA 2027, Smart Cube will appear in Shanghai again with more new products and more complete solutions, joining hands with industry partners to explore new opportunities in the industry and start a new journey of semiconductor upgrading! The show never ends, and innovation never stops. Smart Cube looks forward to meeting you again!

About Zhilifang

Shenzhen Zhilifang Automation Equipment Co., Ltd. was established in 2011 and was listed on the GEM on July 11, 2022, with stock code 301312. It belongs to the high-end equipment manufacturing industry. It is a high-tech enterprise focusing on the research and development, production, sales and related technical services of semiconductor and industrial automation equipment. It provides professional solutions for downstream customers' semiconductor process, precision testing, intelligent manufacturing system, lean and automated production system.